MM54HC74J
vs
MC74HC74ADG
feature comparison
All Stats
Differences Only
Rohs Code
No
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
ONSEMI
Package Description
DIP, DIP14,.3
SOIC-14
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
HC/UH
JESD-30 Code
R-GDIP-T14
R-PDSO-G14
JESD-609 Code
e0
e3
Length
19.43 mm
8.65 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Number of Bits
1
1
Number of Functions
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Equivalence Code
DIP14,.3
SOP14,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Propagation Delay (tpd)
52 ns
150 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
1.75 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
3 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
MATTE TIN
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
7.62 mm
3.9 mm
fmax-Min
18 MHz
24 MHz
Base Number Matches
3
1
Pbfree Code
Yes
Part Package Code
SOIC-14 NB
Pin Count
14
Manufacturer Package Code
751A-03
ECCN Code
EAR99
Factory Lead Time
20 Weeks, 1 Day
Samacsys Manufacturer
onsemi
Max Frequency@Nom-Sup
20000000 Hz
Max I(ol)
0.004 A
Moisture Sensitivity Level
1
Packing Method
RAIL
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
30
Compare MM54HC74J with alternatives
Compare MC74HC74ADG with alternatives