MM54HC32J/883C
vs
GD54HC32
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
GOLDSTAR ELECTRON CO LTD
Package Description
DIP, DIP14,.3
,
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Family
HC/UH
HC/UH
JESD-30 Code
R-GDIP-T14
R-PDIP-T14
JESD-609 Code
e0
Length
19.43 mm
Logic IC Type
OR GATE
OR GATE
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
150 ns
27 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
Screening Level
MIL-STD-883
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
4.5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Base Number Matches
3
1
Load Capacitance (CL)
50 pF
Compare MM54HC32J/883C with alternatives
Compare GD54HC32 with alternatives