MM54HC283W
vs
TC74HC283AF-EL
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
TOSHIBA CORP
Part Package Code
DFP
SOIC
Package Description
DFP, FL16,.3
SOP,
Pin Count
16
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
FULL ADDER; WITH INTERNAL CARRY LOOKAHEAD; PERMITS RIPPLE CARRY CASCADING
FULL ADDER; WITH INTERNAL CARRY LOOKAHEAD; PERMITS RIPPLE CARRY CASCADING
Family
HC/UH
HC/UH
JESD-30 Code
R-GDFP-F16
R-PDSO-G16
JESD-609 Code
e0
e0
Length
9.6645 mm
10.3 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
ADDER/SUBTRACTOR
ADDER/SUBTRACTOR
Number of Bits
4
4
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DFP
SOP
Package Equivalence Code
FL16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
SMALL OUTLINE
Propagation Delay (tpd)
59 ns
53 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.032 mm
1.9 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
FLAT
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
6.604 mm
5.3 mm
Base Number Matches
3
3
Pbfree Code
Compare MM54HC283W with alternatives
Compare TC74HC283AF-EL with alternatives