MM54HC157J/883C
vs
CD54HC157F3A
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
TEXAS INSTRUMENTS INC
|
| Package Description |
DIP, DIP16,.3
|
DIP-16
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
R-XDIP-T16
|
R-GDIP-T16
|
| JESD-609 Code |
e0
|
e0
|
| Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
| Number of Functions |
4
|
4
|
| Number of Inputs |
2
|
2
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
CERAMIC
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP16,.3
|
DIP16,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-STD-883 Class C
|
38535Q/M;38534H;883B
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
1
|
2
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
16
|
| ECCN Code |
|
EAR99
|
| Samacsys Manufacturer |
|
Texas Instruments
|
| Family |
|
HC/UH
|
| Length |
|
19.56 mm
|
| Load Capacitance (CL) |
|
50 pF
|
| Max I(ol) |
|
0.0052 A
|
| Number of Bits |
|
2
|
| Number of Outputs |
|
1
|
| Output Polarity |
|
TRUE
|
| Packing Method |
|
TUBE
|
| Power Supply Current-Max (ICC) |
|
0.16 mA
|
| Prop. Delay@Nom-Sup |
|
10 ns
|
| Propagation Delay (tpd) |
|
190 ns
|
| Seated Height-Max |
|
5.08 mm
|
| Supply Voltage-Max (Vsup) |
|
6 V
|
| Supply Voltage-Min (Vsup) |
|
2 V
|
| Supply Voltage-Nom (Vsup) |
|
4.5 V
|
| Width |
|
7.62 mm
|
|
|
|
Compare MM54HC157J/883C with alternatives
Compare CD54HC157F3A with alternatives