MM54C922J/883
vs
MM74C922J
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
ROCHESTER ELECTRONICS LLC
Package Description
DIP, DIP18,.3
DIP,
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
CMOS
CMOS
JESD-30 Code
R-GDIP-T18
R-GDIP-T18
JESD-609 Code
e0
Logic IC Type
ENCODER
ENCODER
Number of Bits
8
8
Number of Functions
1
1
Number of Terminals
18
18
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP18,.3
DIP18,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
210 ns
150 ns
Qualification Status
Not Qualified
Screening Level
MIL-STD-883
Seated Height-Max
5.08 mm
5.08 mm
Supply Voltage-Max (Vsup)
15 V
15 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
3
1
Additional Feature
LG_MAX
Length
23.24 mm
Compare MM54C922J/883 with alternatives
Compare MM74C922J with alternatives