MM54C73J
vs
MC14175BALDS
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
MOTOROLA INC
Package Description
DIP, DIP14,.3
DIP, DIP16,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
MASTER SLAVE OPERATION
Family
CMOS
4000/14000/40000
JESD-30 Code
R-GDIP-T14
R-GDIP-T16
JESD-609 Code
e0
e0
Length
19.43 mm
19.3 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
J-K FLIP-FLOP
D FLIP-FLOP
Max Frequency@Nom-Sup
2500000 Hz
2000000 Hz
Max I(ol)
0.00035999999999999997 A
Number of Bits
2
4
Number of Functions
2
1
Number of Terminals
14
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
300 ns
400 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
4.19 mm
Supply Voltage-Max (Vsup)
15 V
18 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Trigger Type
NEGATIVE EDGE
POSITIVE EDGE
Width
7.62 mm
7.62 mm
fmax-Min
2.5 MHz
2 MHz
Base Number Matches
2
3
Part Package Code
DIP
Pin Count
16
Compare MM54C73J with alternatives
Compare MC14175BALDS with alternatives