MM54C200J
vs
MCM10144L
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
MOTOROLA INC
|
Package Description |
DIP, DIP16,.3
|
DIP, DIP16,.3
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A001.A.2.C
|
EAR99
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
1200 ns
|
26 ns
|
I/O Type |
SEPARATE
|
|
JESD-30 Code |
R-CDIP-T16
|
R-GDIP-T16
|
JESD-609 Code |
e0
|
e0
|
Length |
19.43 mm
|
19.3 mm
|
Memory Density |
256 bit
|
256 bit
|
Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
Memory Width |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Ports |
1
|
1
|
Number of Terminals |
16
|
16
|
Number of Words |
256 words
|
256 words
|
Number of Words Code |
256
|
256
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
125 °C
|
75 °C
|
Operating Temperature-Min |
-55 °C
|
|
Organization |
256X1
|
256X1
|
Output Characteristics |
3-STATE
|
OPEN-EMITTER
|
Output Enable |
NO
|
NO
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, GLASS-SEALED
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP16,.3
|
DIP16,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
5.08 mm
|
4.19 mm
|
Supply Voltage-Max (Vsup) |
15 V
|
|
Supply Voltage-Min (Vsup) |
3 V
|
|
Supply Voltage-Nom (Vsup) |
5 V
|
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
ECL
|
Temperature Grade |
MILITARY
|
COMMERCIAL EXTENDED
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
7.62 mm
|
7.62 mm
|
Base Number Matches |
2
|
3
|
Supply Current-Max |
|
0.13 mA
|
|
|
|
Compare MM54C200J with alternatives
Compare MCM10144L with alternatives