Findchips: Compare MM54C107N vs HEF40175BT,652

MM54C107N vs HEF40175BT,652 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Obsolete	Transferred
Ihs Manufacturer	NATIONAL SEMICONDUCTOR CORP	NXP SEMICONDUCTORS
Package Description	DIP,	PLASTIC, SO-16
Reach Compliance Code	unknown	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Family	CMOS	4000/14000/40000
JESD-30 Code	R-PDIP-T14	R-PDSO-G16
Length	19.215 mm	9.9 mm
Load Capacitance (CL)	50 pF	50 pF
Logic IC Type	J-K FLIP-FLOP	D FLIP-FLOP
Number of Bits	2	4
Number of Functions	2	1
Number of Terminals	14	16
Operating Temperature-Max	125 °C	85 °C
Operating Temperature-Min	-55 °C	-40 °C
Output Polarity	COMPLEMENTARY	COMPLEMENTARY
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	DIP	SOP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	IN-LINE	SMALL OUTLINE
Propagation Delay (tpd)	300 ns	160 ns
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	5.08 mm	1.75 mm
Supply Voltage-Max (Vsup)	15 V	15 V
Supply Voltage-Min (Vsup)	3 V	3 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	NO	YES
Technology	CMOS	CMOS
Temperature Grade	MILITARY	INDUSTRIAL
Terminal Form	THROUGH-HOLE	GULL WING
Terminal Pitch	2.54 mm	1.27 mm
Terminal Position	DUAL	DUAL
Trigger Type	NEGATIVE EDGE	POSITIVE EDGE
Width	7.62 mm	3.9 mm
fmax-Min	2.5 MHz	5 MHz
Base Number Matches	1	2
Rohs Code		Yes
Part Package Code		SOP
Pin Count		16
Manufacturer Package Code		SOT109-1
Factory Lead Time		4 Weeks
JESD-609 Code		e4
Max Frequency@Nom-Sup		5000000 Hz
Moisture Sensitivity Level		1
Package Equivalence Code		SOP16,.25
Peak Reflow Temperature (Cel)		260
Terminal Finish		Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s)		30
	Logic » FF/Latches	Logic » FF/Latches