MM1P-67201AV-25 vs 7201LA30DBG feature comparison

MM1P-67201AV-25 Matra MHS

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7201LA30DBG Integrated Device Technology Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MATRA MHS INTEGRATED DEVICE TECHNOLOGY INC
Package Description , DIP,
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 25 ns 80 ns
Additional Feature RETRANSMIT; 2V DATA RETENTION RETRANSMIT
Cycle Time 35 ns 100 ns
JESD-30 Code R-GDIP-T28 R-GDIP-T28
Memory Density 4608 bit 9216 bit
Memory IC Type OTHER FIFO OTHER FIFO
Memory Width 9 9
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 512 words 512 words
Number of Words Code 512 1000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 512X9 1KX9
Output Characteristics 3-STATE
Output Enable NO YES
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Current-Max 0.14 mA 0.08 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 4 2
Pbfree Code Yes
Rohs Code Yes
Part Package Code DIP
Pin Count 28
JESD-609 Code e3
Length 37.211 mm
Package Code DIP
Screening Level MIL-STD-883 Class B
Seated Height-Max 5.08 mm
Terminal Finish MATTE TIN
Terminal Pitch 2.54 mm
Width 15.24 mm

Compare MM1P-67201AV-25 with alternatives

Compare 7201LA30DBG with alternatives