MM1P-67201AL-25SHXXX
vs
MU9C0591-20PC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
TEMIC SEMICONDUCTORS
MUSIC SEMICONDUCTORS INC
Reach Compliance Code
unknown
unknown
kg CO2e/kg
12.3
12.3
Average Weight (mg)
6890.8
6890.8
CO2e (mg)
84756.839
84756.839
Category CO2 Kg
12.3
12.3
Compliance Temperature Grade
Military: -55C to +125C
Commercial: +0C to +70C
Access Time-Max
25 ns
20 ns
Cycle Time
35 ns
30 ns
JESD-30 Code
R-GDIP-T28
R-PDIP-T28
Memory Density
4608 bit
4608 bit
Memory Width
9
9
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
512 words
512 words
Number of Words Code
512
512
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
512X9
512X9
Output Characteristics
3-STATE
3-STATE
Output Enable
NO
NO
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
2
1
Pbfree Code
Rohs Code
Package Description
DIP, DIP28,.6
ECCN Code
EAR99
HTS Code
8542.32.00.71
Additional Feature
RETRANSMIT
Clock Frequency-Max (fCLK)
33.33 MHz
JESD-609 Code
e0
Memory IC Type
OTHER FIFO
Moisture Sensitivity Level
3
Package Equivalence Code
DIP28,.6
Standby Current-Max
0.0005 A
Supply Current-Max
0.1 mA
Terminal Finish
TIN LEAD
Terminal Pitch
2.54 mm
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