MM0-67204E-50QM
vs
SM0-67204E-40/883
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
TEMIC SEMICONDUCTORS
TEMIC SEMICONDUCTORS
Package Description
DIE
DIE
Reach Compliance Code
unknown
unknown
Access Time-Max
50 ns
40 ns
Cycle Time
65 ns
50 ns
JESD-30 Code
X-XUUC-N
X-XUUC-N
Memory Density
36864 bit
36864 bit
Memory Width
9
9
Number of Functions
1
1
Number of Words
4096 words
4096 words
Number of Words Code
4000
4000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
4KX9
4KX9
Output Enable
NO
NO
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Shape
UNSPECIFIED
UNSPECIFIED
Package Style
UNCASED CHIP
UNCASED CHIP
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-PRF-38535 Class Q
MIL-STD-883 Class S
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
NO LEAD
NO LEAD
Terminal Position
UPPER
UPPER
Base Number Matches
2
2