MLXV3823AE3
vs
SMAJ6487
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MICROSEMI CORP
|
MICROSEMI CORP
|
Package Description |
O-LELF-R2
|
PLASTIC, SMAJ, 2 PIN
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.50
|
8541.10.00.50
|
Additional Feature |
METALLURGICALLY BONDED
|
HIGH RELIABILITY, METALLURGICALLY BONDED
|
Case Connection |
ISOLATED
|
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
JEDEC-95 Code |
DO-213AB
|
DO-214BA
|
JESD-30 Code |
O-LELF-R2
|
R-PDSO-C2
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
200 °C
|
150 °C
|
Operating Temperature-Min |
-65 °C
|
|
Package Body Material |
GLASS
|
PLASTIC/EPOXY
|
Package Shape |
ROUND
|
RECTANGULAR
|
Package Style |
LONG FORM
|
SMALL OUTLINE
|
Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
Power Dissipation-Max |
1.5 W
|
1.5 W
|
Reference Standard |
MIL-19500/115
|
|
Reference Voltage-Nom |
3.9 V
|
3.9 V
|
Surface Mount |
YES
|
YES
|
Technology |
ZENER
|
ZENER
|
Terminal Form |
WRAP AROUND
|
C BEND
|
Terminal Position |
END
|
DUAL
|
Voltage Tol-Max |
5%
|
5%
|
Working Test Current |
64 mA
|
64 mA
|
Base Number Matches |
1
|
27
|
Rohs Code |
|
No
|
Part Package Code |
|
DO-214BA
|
Pin Count |
|
2
|
Dynamic Impedance-Max |
|
400 Ω
|
JESD-609 Code |
|
e0
|
Qualification Status |
|
Not Qualified
|
Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare MLXV3823AE3 with alternatives
Compare SMAJ6487 with alternatives