MLX3826A-1
vs
JAN1N3826AUR-1
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Part Package Code
DO-213AB
Package Description
O-XELF-R2
DO-213AB, 2 PIN
Pin Count
2
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
HTS Code
8541.10.00.50
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-213AB
DO-213AB
JESD-30 Code
O-XELF-R2
O-LELF-R2
JESD-609 Code
e0
e0
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
UNSPECIFIED
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
1 W
1 W
Qualification Status
Not Qualified
Qualified
Reference Voltage-Nom
5.1 V
5.1 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Voltage Tol-Max
5%
5%
Working Test Current
49 mA
49 mA
Base Number Matches
1
8
Factory Lead Time
20 Weeks
Additional Feature
METALLURGICALLY BONDED
Moisture Sensitivity Level
1
Reference Standard
MIL-19500/115K
Compare MLX3826A-1 with alternatives
Compare JAN1N3826AUR-1 with alternatives