MLL6006CURE3
vs
MVMLL6006CUR
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MICROSEMI CORP
MICROSEMI CORP
Package Description
O-LELF-R2
O-LELF-R2
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Additional Feature
METALLURGICALLY BONDED
METALLURGICALLY BONDED
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-213AA
DO-213AA
JESD-30 Code
O-LELF-R2
O-LELF-R2
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
175 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.5 W
Reference Voltage-Nom
18 V
18 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Voltage Tol-Max
2%
2%
Working Test Current
5 mA
5 mA
Base Number Matches
1
1
Rohs Code
Part Package Code
DO-213AA
Pin Count
2
JESD-609 Code
e0
Moisture Sensitivity Level
1
Qualification Status
Not Qualified
Terminal Finish
TIN LEAD
Compare MLL6006CURE3 with alternatives
Compare MVMLL6006CUR with alternatives