MLL5956B vs HSMBJ5956BE3TR feature comparison

MLL5956B Microsemi Corporation

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HSMBJ5956BE3TR Microsemi Corporation

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Part Package Code DO-213AB DO-214AA
Package Description HERMETIC SEALED, GLASS, MELF-2 R-PDSO-C2
Pin Count 2 2
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Additional Feature METALLURGICALLY BONDED, HIGH RELIABILITY
Case Connection ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 1200 Ω
JEDEC-95 Code DO-213AB DO-214AA
JESD-30 Code O-LELF-R2 R-PDSO-C2
JESD-609 Code e0 e3
Knee Impedance-Max 8000 Ω
Moisture Sensitivity Level 1 1
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 200 °C 150 °C
Operating Temperature-Min -65 °C -65 °C
Package Body Material GLASS PLASTIC/EPOXY
Package Shape ROUND RECTANGULAR
Package Style LONG FORM SMALL OUTLINE
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 1.25 W 1.56 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 200 V 200 V
Reverse Current-Max 1 µA
Surface Mount YES YES
Technology ZENER ZENER
Terminal Finish TIN LEAD MATTE TIN
Terminal Form WRAP AROUND C BEND
Terminal Position END DUAL
Voltage Tol-Max 5% 5%
Working Test Current 1.9 mA 1.9 mA
Base Number Matches 1 1

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