MLL5546B-1
vs
CD5546B
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
DO-213AA
|
|
| Package Description |
O-XELF-R2
|
DIE-1
|
| Pin Count |
2
|
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8541.10.00.50
|
|
| Case Connection |
ISOLATED
|
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| JEDEC-95 Code |
DO-213AA
|
|
| JESD-30 Code |
O-XELF-R2
|
S-XUUC-N1
|
| JESD-609 Code |
e0
|
e0
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
1
|
| Operating Temperature-Max |
175 °C
|
200 °C
|
| Operating Temperature-Min |
-65 °C
|
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Shape |
ROUND
|
SQUARE
|
| Package Style |
LONG FORM
|
UNCASED CHIP
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
0.5 W
|
0.5 W
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reference Voltage-Nom |
33 V
|
33 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
ZENER
|
ZENER
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
WRAP AROUND
|
NO LEAD
|
| Terminal Position |
END
|
UPPER
|
| Voltage Tol-Max |
5%
|
5%
|
| Working Test Current |
1 mA
|
1 mA
|
| Base Number Matches |
3
|
1
|
| Dynamic Impedance-Max |
|
100 Ω
|
|
|
|
Compare MLL5546B-1 with alternatives
Compare CD5546B with alternatives