MLL5263BE3 vs CDLL5263B feature comparison

MLL5263BE3 Microsemi Corporation

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CDLL5263B Microchip Technology Inc

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Rohs Code Yes No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer MICROSEMI CORP MICROCHIP TECHNOLOGY INC
Package Description O-LELF-R2 HERMETIC SEALED, GLASS, SOD-80, LL34, MELF-2
Reach Compliance Code compliant compliant
ECCN Code EAR99
HTS Code 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 150 Ω
JEDEC-95 Code DO-213AA DO-213AA
JESD-30 Code O-LELF-R2 O-LELF-R2
JESD-609 Code e3 e0
Knee Impedance-Max 1300 Ω
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 200 °C 175 °C
Operating Temperature-Min -65 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.5 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 56 V 56 V
Reverse Current-Max 0.1 µA
Surface Mount YES YES
Technology ZENER ZENER
Terminal Finish MATTE TIN TIN LEAD
Terminal Form WRAP AROUND WRAP AROUND
Terminal Position END END
Voltage Temp Coeff-Max 53.76 mV/°C
Voltage Tol-Max 5% 5%
Working Test Current 2.2 mA 2.2 mA
Base Number Matches 1 3
Factory Lead Time 14 Weeks
Additional Feature METALLURGICALLY BONDED

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