MLL4370A-1E3
vs
TZM5221B-GS18
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MICROSEMI CORP
TELEFUNKEN MICROELECTRONICS GMBH
Package Description
O-XELF-R2
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8541.10.00.50
Case Connection
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
30 Ω
30 Ω
JEDEC-95 Code
DO-213AA
DO-213AA
JESD-30 Code
O-LELF-R2
O-LELF-R2
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
175 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
Power Dissipation-Max
0.4 W
0.5 W
Reference Voltage-Nom
0.02 V
2.4 V
Surface Mount
YES
YES
Technology
ZENER
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Voltage Tol-Max
5%
5%
Working Test Current
2.4 mA
20 mA
Base Number Matches
1
3
JESD-609 Code
e0
Terminal Finish
Tin/Lead (Sn/Pb)
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