MLL3025B-1 vs JAN1N3025BUR-1 feature comparison

MLL3025B-1 Microsemi Corporation

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JAN1N3025BUR-1 Microchip Technology Inc

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer MICROSEMI CORP MICROCHIP TECHNOLOGY INC
Part Package Code DO-213AB
Package Description O-XELF-R2 DO-213AB, 2 PIN
Pin Count 2
Reach Compliance Code compliant compliant
ECCN Code EAR99
HTS Code 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-213AB DO-213AB
JESD-30 Code O-XELF-R2 O-LELF-R2
JESD-609 Code e0 e0
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material UNSPECIFIED GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 1 W 1 W
Qualification Status Not Qualified Qualified
Reference Voltage-Nom 16 V 16 V
Surface Mount YES YES
Technology ZENER ZENER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form WRAP AROUND WRAP AROUND
Terminal Position END END
Voltage Tol-Max 5% 5%
Working Test Current 15.5 mA 15.5 mA
Base Number Matches 2 1
Factory Lead Time 20 Weeks
Additional Feature METALLURGICALLY BONDED
Moisture Sensitivity Level 1
Reference Standard MIL-19500/115K

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