MLG0603P1N3CT000
vs
BSCQ000603031N3C00
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
TDK CORP
|
PULSE ELECTRONICS CORP
|
Package Description |
0201
|
CHIP
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8504.50.80.00
|
|
Factory Lead Time |
12 Weeks
|
22 Weeks
|
Samacsys Manufacturer |
TDK
|
|
Case/Size Code |
0201
|
0201
|
Construction |
Rectangular
|
Rectangular
|
Core Material |
CERAMIC
|
Ceramic
|
DC Resistance |
0.08 Ω
|
0.09 Ω
|
Inductance-Nom (L) |
0.0013 µH
|
0.0013 µH
|
Inductor Application |
RF INDUCTOR
|
RF INDUCTOR
|
Inductor Type |
GENERAL PURPOSE INDUCTOR
|
GENERAL PURPOSE INDUCTOR
|
Number of Functions |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Package Height |
0.3 mm
|
0.3 mm
|
Package Length |
0.6 mm
|
0.6 mm
|
Package Style |
SMT
|
SMT
|
Package Width |
0.3 mm
|
0.3 mm
|
Packing Method |
TR, PUNCHED PAPER, 7 INCH
|
TR, Paper, 7 Inch
|
Quality Factor-Min (at L-nom) |
14
|
|
Rated Current-Max |
0.8 A
|
0.76 A
|
Self Resonance Frequency |
10000 MHz
|
10000 MHz
|
Shape/Size Description |
RECTANGULAR PACKAGE
|
RECTANGULAR PACKAGE
|
Shielded |
NO
|
NO
|
Surface Mount |
YES
|
YES
|
Terminal Placement |
DUAL ENDED
|
DUAL ENDED
|
Terminal Shape |
WRAPAROUND
|
WRAPAROUND
|
Test Frequency |
500 MHz
|
500 MHz
|
Tolerance |
15.38%
|
15.3846%
|
Base Number Matches |
1
|
1
|
|
|
|
Compare MLG0603P1N3CT000 with alternatives
Compare BSCQ000603031N3C00 with alternatives