MLG0603P1N3BTD25
vs
HKQ0603U1N3B-T
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
TDK CORP
|
TAIYO YUDEN CO LTD
|
| Package Description |
0201
|
CHIP
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8504.50.80.00
|
8504.50.80.00
|
| Factory Lead Time |
12 Weeks
|
|
| Samacsys Manufacturer |
TDK
|
TAIYO YUDEN
|
| Case/Size Code |
0201
|
0201
|
| Construction |
Rectangular
|
Multilayer Chip
|
| Core Material |
CERAMIC
|
Ferrite
|
| DC Resistance |
0.08 Ω
|
0.09 Ω
|
| Inductance-Nom (L) |
0.0013 µH
|
0.0013 µH
|
| Inductor Application |
RF INDUCTOR
|
RF INDUCTOR
|
| Inductor Type |
GENERAL PURPOSE INDUCTOR
|
GENERAL PURPOSE INDUCTOR
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Height |
0.3 mm
|
0.3 mm
|
| Package Length |
0.6 mm
|
0.6 mm
|
| Package Style |
SMT
|
SMT
|
| Package Width |
0.3 mm
|
0.3 mm
|
| Packing Method |
TR, PUNCHED PAPER, 7 INCH
|
TR, PAPER, 7 INCH
|
| Quality Factor-Min (at L-nom) |
14
|
14
|
| Rated Current-Max |
0.8 A
|
0.76 A
|
| Reference Standard |
AEC-Q200
|
|
| Self Resonance Frequency |
10000 MHz
|
10000 MHz
|
| Shape/Size Description |
RECTANGULAR PACKAGE
|
RECTANGULAR PACKAGE
|
| Shielded |
NO
|
NO
|
| Special Feature |
0.1NH IS THE TOLERANCE
|
|
| Surface Mount |
YES
|
YES
|
| Terminal Placement |
DUAL ENDED
|
DUAL ENDED
|
| Terminal Shape |
WRAPAROUND
|
WRAPAROUND
|
| Test Frequency |
500 MHz
|
500 MHz
|
| Tolerance |
7.69%
|
7.692%
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare MLG0603P1N3BTD25 with alternatives
Compare HKQ0603U1N3B-T with alternatives