MLG0603P1N0BT
vs
CIH03U1N0BNC
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
TDK CORP
SAMSUNG ELECTRO-MECHANICS
Package Description
0201
0201
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8504.50.80.00
8504.50.80.00
Case/Size Code
0201
0201
Construction
Multilayer Chip
Chip
Core Material
CERAMIC
Ceramic
DC Resistance
0.07 Ω
0.07 Ω
Inductance-Nom (L)
0.001 µH
0.001 µH
Inductor Application
RF INDUCTOR
RF INDUCTOR
Inductor Type
GENERAL PURPOSE INDUCTOR
GENERAL PURPOSE INDUCTOR
Number of Functions
1
1
Number of Terminals
2
2
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.3 mm
0.3 mm
Package Length
0.6 mm
0.6 mm
Package Style
SMT
SMT
Package Width
0.3 mm
0.3 mm
Packing Method
TR, 7 Inch
Tape, Paper
Quality Factor-Min (at L-nom)
14
15
Rated Current-Max
1 A
1 A
Self Resonance Frequency
10000 MHz
10000 MHz
Shape/Size Description
RECTANGULAR PACKAGE
RECTANGULAR PACKAGE
Shielded
NO
NO
Special Feature
INDUCTANCE TOLERANCE IS 0.1 NANO HENRY
Surface Mount
YES
YES
Terminal Placement
DUAL ENDED
DUAL ENDED
Terminal Shape
WRAPAROUND
WRAPAROUND
Test Frequency
500 MHz
500 MHz
Tolerance
10%
10%
Base Number Matches
3
1
Compare MLG0603P1N0BT with alternatives
Compare CIH03U1N0BNC with alternatives