ML2725ADH vs UAA2067G-T feature comparison

ML2725ADH RF Micro Devices Inc

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UAA2067G-T NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICRO LINEAR CORP NXP SEMICONDUCTORS
Part Package Code QFP
Package Description TQFP, LFQFP,
Pin Count 32
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PQFP-G32 S-PQFP-G32
Length 7 mm 5 mm
Number of Functions 1 1
Number of Terminals 32 32
Operating Temperature-Max 60 °C 85 °C
Operating Temperature-Min -10 °C -30 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TQFP LFQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, THIN PROFILE FLATPACK, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.6 mm
Surface Mount YES YES
Telecom IC Type CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT CORDLESS TELEPHONE SUPPORT CIRCUIT
Temperature Grade COMMERCIAL OTHER
Terminal Form GULL WING GULL WING
Terminal Pitch 0.8 mm 0.5 mm
Terminal Position QUAD QUAD
Width 7 mm 5 mm
Base Number Matches 1 1
Supply Voltage-Nom 3.6 V
Technology BICMOS

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