ML2725ADH
vs
UAA2067G-T
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICRO LINEAR CORP
NXP SEMICONDUCTORS
Part Package Code
QFP
Package Description
TQFP,
LFQFP,
Pin Count
32
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PQFP-G32
S-PQFP-G32
Length
7 mm
5 mm
Number of Functions
1
1
Number of Terminals
32
32
Operating Temperature-Max
60 °C
85 °C
Operating Temperature-Min
-10 °C
-30 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TQFP
LFQFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, THIN PROFILE
FLATPACK, LOW PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.6 mm
Surface Mount
YES
YES
Telecom IC Type
CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT
CORDLESS TELEPHONE SUPPORT CIRCUIT
Temperature Grade
COMMERCIAL
OTHER
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.8 mm
0.5 mm
Terminal Position
QUAD
QUAD
Width
7 mm
5 mm
Base Number Matches
1
1
Supply Voltage-Nom
3.6 V
Technology
BICMOS
Compare ML2725ADH with alternatives
Compare UAA2067G-T with alternatives