ML2724DH-T
vs
UAA2067GBE
feature comparison
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
MICRO LINEAR CORP
|
NXP SEMICONDUCTORS
|
Part Package Code |
QFP
|
QFP
|
Package Description |
TQFP,
|
LFQFP,
|
Pin Count |
32
|
32
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PQFP-G32
|
S-PQFP-G32
|
Length |
7 mm
|
5 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
32
|
32
|
Operating Temperature-Max |
60 °C
|
85 °C
|
Operating Temperature-Min |
-10 °C
|
-30 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TQFP
|
LFQFP
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, THIN PROFILE
|
FLATPACK, LOW PROFILE, FINE PITCH
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.2 mm
|
1.6 mm
|
Supply Voltage-Nom |
3.3 V
|
3.6 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT
|
CORDLESS TELEPHONE SUPPORT CIRCUIT
|
Temperature Grade |
COMMERCIAL
|
OTHER
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.8 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
7 mm
|
5 mm
|
Base Number Matches |
1
|
1
|
Technology |
|
BICMOS
|
|
|
|
Compare ML2724DH-T with alternatives
Compare UAA2067GBE with alternatives