ML2724DH vs ML2722DH feature comparison

ML2724DH RF Micro Devices Inc

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ML2722DH RF Micro Devices Inc

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICRO LINEAR CORP SIRENZA MICRODEVICES INC
Part Package Code QFP QFP
Package Description TQFP, TQFP, TQFP32,.35SQ,32
Pin Count 32 32
Reach Compliance Code unknown unknown
ECCN Code 5A991.G
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PQFP-G32 S-PQFP-G32
Length 7 mm 7 mm
Number of Functions 1 1
Number of Terminals 32 32
Operating Temperature-Max 60 °C 60 °C
Operating Temperature-Min -10 °C -10 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TQFP TQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, THIN PROFILE FLATPACK, THIN PROFILE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Telecom IC Type CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position QUAD QUAD
Width 7 mm 7 mm
Base Number Matches 2 2
JESD-609 Code e3
Package Equivalence Code TQFP32,.35SQ,32
Supply Current-Max 63.5 mA
Technology BICMOS
Terminal Finish MATTE TIN

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