ML2722DH
vs
ML13156-8P
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
SIRENZA MICRODEVICES INC
|
LANSDALE SEMICONDUCTOR INC
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
TQFP, TQFP32,.35SQ,32
|
PLASTIC, QFP-32
|
| Pin Count |
32
|
32
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-PQFP-G32
|
S-PQFP-G32
|
| JESD-609 Code |
e3
|
|
| Length |
7 mm
|
7 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
32
|
| Operating Temperature-Max |
60 °C
|
85 °C
|
| Operating Temperature-Min |
-10 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TQFP
|
LQFP
|
| Package Equivalence Code |
TQFP32,.35SQ,32
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, THIN PROFILE
|
FLATPACK, LOW PROFILE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
1.6 mm
|
| Supply Current-Max |
63.5 mA
|
8 mA
|
| Supply Voltage-Nom |
3.3 V
|
-3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
BIPOLAR
|
| Telecom IC Type |
CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT
|
CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
7 mm
|
7 mm
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare ML2722DH with alternatives
Compare ML13156-8P with alternatives