ML2264BMJ
vs
ADC08064CMJ
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
FAIRCHILD SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP,
|
DIP, DIP24,.3
|
| Pin Count |
24
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog Input Voltage-Max |
6.8 V
|
6.1 V
|
| Analog Input Voltage-Min |
-0.3 V
|
-0.1 V
|
| Conversion Time-Max |
1.1 µs
|
0.79 µs
|
| Converter Type |
ADC, FLASH METHOD
|
ADC, FLASH METHOD
|
| JESD-30 Code |
R-GDIP-T24
|
R-GDIP-T24
|
| Length |
32.135 mm
|
|
| Linearity Error-Max (EL) |
0.195%
|
0.4%
|
| Number of Analog In Channels |
1
|
4
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Bit Code |
OFFSET BINARY
|
BINARY
|
| Output Format |
PARALLEL, 8 BITS
|
PARALLEL, 8 BITS
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP24,.3
|
DIP24,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Sample and Hold / Track and Hold |
SAMPLE
|
SAMPLE
|
| Seated Height-Max |
5.08 mm
|
4.572 mm
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
15.24 mm
|
| Base Number Matches |
2
|
2
|
| Rohs Code |
|
No
|
| JESD-609 Code |
|
e0
|
| Sample Rate |
|
1.5 MHz
|
| Supply Current-Max |
|
20 mA
|
| Technology |
|
CMOS
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare ML2264BMJ with alternatives
Compare ADC08064CMJ with alternatives