ML0-67201L-30/883
vs
ML0-67201AL-30P883
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
TEMIC SEMICONDUCTORS
|
TEMIC SEMICONDUCTORS
|
| Package Description |
DIE
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| Access Time-Max |
30 ns
|
30 ns
|
| Cycle Time |
40 ns
|
40 ns
|
| Memory Density |
4608 bit
|
4608 bit
|
| Memory IC Type |
OTHER FIFO
|
|
| Memory Width |
9
|
9
|
| Number of Functions |
1
|
1
|
| Number of Words |
512 words
|
512 words
|
| Number of Words Code |
512
|
512
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Organization |
512X9
|
512X9
|
| Output Enable |
NO
|
NO
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Current-Max |
0.14 mA
|
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Base Number Matches |
1
|
2
|
| JESD-30 Code |
|
X-XUUC-N28
|
| Number of Terminals |
|
28
|
| Output Characteristics |
|
3-STATE
|
| Package Body Material |
|
UNSPECIFIED
|
| Package Code |
|
DIE
|
| Package Shape |
|
UNSPECIFIED
|
| Package Style |
|
UNCASED CHIP
|
| Surface Mount |
|
YES
|
| Terminal Form |
|
NO LEAD
|
| Terminal Position |
|
UPPER
|
|
|
|
Compare ML0-67201L-30/883 with alternatives