MK45H02K-25
vs
7202LA25JGI
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
STMICROELECTRONICS
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
QFJ
QFJ
Package Description
PLASTIC, LCC-32
GREEN, PLASTIC, LCC-32
Pin Count
32
32
Reach Compliance Code
unknown
compliant
Access Time-Max
25 ns
25 ns
Additional Feature
RETRANSMIT
RETRANSMIT
Cycle Time
35 ns
35 ns
JESD-30 Code
R-PQCC-J32
R-PQCC-J32
Length
13.97 mm
13.97 mm
Memory Density
9216 bit
9216 bit
Memory Width
9
9
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
1024 words
1024 words
Number of Words Code
1000
1000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
1KX9
1KX9
Output Characteristics
3-STATE
Output Enable
NO
NO
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
QCCJ
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.556 mm
3.55 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
J BEND
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Width
11.43 mm
11.43 mm
Base Number Matches
1
2
Pbfree Code
Rohs Code
ECCN Code
EAR99
HTS Code
8542.32.00.71
Clock Frequency-Max (fCLK)
28.5 MHz
JESD-609 Code
e3
Memory IC Type
OTHER FIFO
Moisture Sensitivity Level
3
Package Equivalence Code
LDCC32,.5X.6
Peak Reflow Temperature (Cel)
260
Standby Current-Max
0.005 A
Supply Current-Max
0.08 mA
Terminal Finish
Matte Tin (Sn) - annealed
Time@Peak Reflow Temperature-Max (s)
30
Compare MK45H02K-25 with alternatives
Compare 7202LA25JGI with alternatives