MJ80C51XXX/B vs MAB8031-2-12WP feature comparison

MJ80C51XXX/B Matra MHS

Buy Now Datasheet

MAB8031-2-12WP NXP Semiconductors

Buy Now Datasheet
Part Life Cycle Code Obsolete Active
Ihs Manufacturer MATRA MHS NXP SEMICONDUCTORS
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC NO NO
Additional Feature BOOLEAN PROCESSOR BOOLEAN PROCESSOR
Address Bus Width 16 16
Bit Size 8 8
Boundary Scan NO NO
Clock Frequency-Max 12 MHz 12 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 8 8
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code S-CQCC-J44 S-PQCC-J44
Low Power Mode YES NO
Number of DMA Channels
Number of External Interrupts 2 2
Number of I/O Lines 32 32
Number of Serial I/Os 1 1
Number of Terminals 44 44
Number of Timers 2 2
On Chip Data RAM Width 8 8
On Chip Program ROM Width 8
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
PWM Channels NO NO
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Qualification Status Not Qualified Not Qualified
RAM (words) 128 128
ROM (words) 4096 0
ROM Programmability MROM
Speed 12 MHz 12 MHz
Supply Current-Max 21 mA 125 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS NMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Form J BEND J BEND
Terminal Position QUAD QUAD
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 1
Part Package Code LCC
Package Description QCCJ,
Pin Count 44
Length 16.5862 mm
Seated Height-Max 4.57 mm
Terminal Pitch 1.27 mm
Width 16.5862 mm

Compare MJ80C51XXX/B with alternatives

Compare MAB8031-2-12WP with alternatives