MJ11013 vs 2SB833 feature comparison

MJ11013 STMicroelectronics

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2SB833 Toshiba America Electronic Components

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS TOSHIBA CORP
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.29.00.95
Case Connection COLLECTOR COLLECTOR
Collector Current-Max (IC) 30 A 30 A
Collector-Emitter Voltage-Max 90 V 80 V
Configuration DARLINGTON DARLINGTON WITH BUILT-IN DIODE AND RESISTOR
DC Current Gain-Min (hFE) 200 200
JEDEC-95 Code TO-3 TO-3
JESD-30 Code O-MBFM-P2 O-MBFM-P2
JESD-609 Code e0 e0
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 200 °C
Package Body Material METAL METAL
Package Shape ROUND ROUND
Package Style FLANGE MOUNT FLANGE MOUNT
Polarity/Channel Type PNP PNP
Power Dissipation Ambient-Max 200 W
Power Dissipation-Max (Abs) 200 W
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form PIN/PEG PIN/PEG
Terminal Position BOTTOM BOTTOM
Transistor Application AMPLIFIER SWITCHING
Transistor Element Material SILICON SILICON
VCEsat-Max 4 V
Base Number Matches 1 1
Package Description FLANGE MOUNT, O-MBFM-P2
Transition Frequency-Nom (fT) 10 MHz

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