MICRF506BML
vs
CXM3580UR
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MICREL INC
|
SONY CORP
|
Part Package Code |
DFN
|
DFN
|
Package Description |
HVQCCN,
|
VQCCN,
|
Pin Count |
32
|
26
|
Manufacturer Package Code |
MLF
|
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-XQCC-N32
|
R-PQCC-N26
|
JESD-609 Code |
e0
|
|
Length |
5 mm
|
3.4 mm
|
Moisture Sensitivity Level |
2
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
32
|
26
|
Operating Temperature-Max |
85 °C
|
90 °C
|
Operating Temperature-Min |
-40 °C
|
-35 °C
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
VQCCN
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
240
|
NOT SPECIFIED
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1 mm
|
0.6 mm
|
Supply Voltage-Nom |
2.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
RF AND BASEBAND CIRCUIT
|
RF AND BASEBAND CIRCUIT
|
Temperature Grade |
INDUSTRIAL
|
OTHER
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.4 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
Width |
5 mm
|
2.6 mm
|
Base Number Matches |
2
|
1
|
Technology |
|
CMOS
|
|
|
|
Compare MICRF506BML with alternatives
Compare CXM3580UR with alternatives