MICRF505YML-TR
vs
MICRF505LYML-TR
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
LEAD FREE, MLF-32
|
LEAD FREE, MLF-32
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
25 Weeks
|
|
| Samacsys Manufacturer |
Microchip
|
Microchip
|
| JESD-609 Code |
e4
|
e4
|
| Moisture Sensitivity Level |
2
|
2
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Telecom IC Type |
RF AND BASEBAND CIRCUIT
|
RF AND BASEBAND CIRCUIT
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
NICKEL PALLADIUM GOLD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Base Number Matches |
2
|
2
|
| ECCN Code |
|
EAR99
|
| JESD-30 Code |
|
S-XQCC-N32
|
| Length |
|
5 mm
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
32
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
|
UNSPECIFIED
|
| Package Code |
|
HVQCCN
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Seated Height-Max |
|
0.9 mm
|
| Supply Voltage-Nom |
|
2.5 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Form |
|
NO LEAD
|
| Terminal Pitch |
|
0.5 mm
|
| Terminal Position |
|
QUAD
|
| Width |
|
5 mm
|
|
|
|
Compare MICRF505YML-TR with alternatives
Compare MICRF505LYML-TR with alternatives