MIC94030YM4-TR
vs
MIC94030BM4
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
SANDISK CORP
|
| Package Description |
LEAD FREE, PLASTIC PACKAGE-4
|
SOT-143, 4 PIN
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
|
| Samacsys Manufacturer |
Microchip
|
|
| Case Connection |
SUBSTRATE
|
SUBSTRATE
|
| Configuration |
SINGLE WITH BUILT-IN DIODE AND RESISTOR
|
SINGLE WITH BUILT-IN DIODE AND RESISTOR
|
| DS Breakdown Voltage-Min |
13.5 V
|
13.5 V
|
| Drain Current-Max (ID) |
1 A
|
1 A
|
| Drain-source On Resistance-Max |
1 Ω
|
1 Ω
|
| FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
| JESD-30 Code |
R-PDSO-G4
|
R-PDSO-G4
|
| JESD-609 Code |
e4
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
4
|
4
|
| Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Polarity/Channel Type |
P-CHANNEL
|
P-CHANNEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Transistor Application |
SWITCHING
|
SWITCHING
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Base Number Matches |
2
|
1
|
| Part Package Code |
|
SOT-143
|
| Pin Count |
|
4
|
|
|
|
Compare MIC94030YM4-TR with alternatives
Compare MIC94030BM4 with alternatives