MIC826MYMT-TR
vs
MIC826MYMT
feature comparison
Pbfree Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
TDFN-6
|
TDFN-6
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
|
Samacsys Manufacturer |
Microchip
|
|
Additional Feature |
BAT BUP SW:N;MNL RST:Y;OV DET:N;PW FL IP:N;PW FL IO:N;PW FL OP:N;PRG RST DLY:N;UV DET:N;WD:Y;WWD:N
|
BAT BUP SW:N;MNL RST:Y;OV DET:N;PW FL IP:N;PW FL IO:N;PW FL OP:N;PRG RST DLY:N;UV DET:N;WD:Y;WWD:N
|
Adjustable Threshold |
NO
|
NO
|
Analog IC - Other Type |
VOLTAGE SUPERVISOR/RESET IC
|
VOLTAGE SUPERVISOR/RESET IC
|
JESD-30 Code |
S-PDSO-N6
|
S-PDSO-N6
|
JESD-609 Code |
e4
|
e4
|
Length |
1.6 mm
|
1.6 mm
|
Number of Channels |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
6
|
6
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVSON
|
HVSON
|
Package Equivalence Code |
SOLCC6,.06,20
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
Seated Height-Max |
0.6 mm
|
0.6 mm
|
Supply Current-Max (Isup) |
0.014 mA
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
1 V
|
1 V
|
Supply Voltage-Nom (Vsup) |
4.5 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
DUAL
|
Threshold Voltage-Nom |
+4.375V
|
+4.375V
|
Width |
1.6 mm
|
1.6 mm
|
Base Number Matches |
1
|
3
|
|
|
|