MIC7211BM5
vs
MIC7221YM5-TR
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MICREL INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
SOT-23
|
|
| Package Description |
LSSOP, TSOP5/6,.11,37
|
SOT-23, 5 PIN
|
| Pin Count |
5
|
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Amplifier Type |
COMPARATOR
|
COMPARATOR
|
| Input Offset Voltage-Max |
10000 µV
|
10000 µV
|
| JESD-30 Code |
R-PDSO-G5
|
R-PDSO-G5
|
| JESD-609 Code |
e0
|
e4
|
| Length |
2.9 mm
|
2.9 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
5
|
5
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Type |
PUSH-PULL
|
OPEN-DRAIN
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LSSOP
|
LSSOP
|
| Package Equivalence Code |
TSOP5/6,.11,37
|
TSOP5/6,.11,37
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
240
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Response Time-Nom |
75 ns
|
75 ns
|
| Seated Height-Max |
1.45 mm
|
1.45 mm
|
| Supply Current-Max |
0.014 mA
|
0.014 mA
|
| Supply Voltage Limit-Max |
12 V
|
12 V
|
| Supply Voltage-Nom (Vsup) |
2.7 V
|
2.7 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn85Pb15)
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.95 mm
|
0.95 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
| Width |
1.6 mm
|
1.6 mm
|
| Base Number Matches |
3
|
2
|
| Factory Lead Time |
|
9 Weeks, 3 Days
|
| Samacsys Manufacturer |
|
Microchip
|
| Packing Method |
|
TR
|
|
|
|
Compare MIC7211BM5 with alternatives