MIC706SM vs MIC708SNY feature comparison

MIC706SM Micrel Inc

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MIC708SNY Microchip Technology Inc

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Rohs Code No Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer MICREL INC MICROCHIP TECHNOLOGY INC
Package Description PLASTIC, SOIC-8 LEAD FREE, PLASTIC, DIP-8
Reach Compliance Code not_compliant compliant
Additional Feature BAT BUP SW:N;MNL RST:Y;OV DET:N;PW FL IP:N;PW FL IO:N;PW FL OP:N;PRG RST DLY:N;UV DET:N;WD:Y;WWD:N BAT BUP SW:N;MNL RST:Y;OV DET:N;PW FL IP:N;PW FL IO:N;PW FL OP:N;PRG RST DLY:N;UV DET:N;WD:Y;WWD:N
Adjustable Threshold NO NO
Analog IC - Other Type VOLTAGE SUPERVISOR/RESET IC VOLTAGE SUPERVISOR/RESET IC
JESD-30 Code R-PDSO-G8 R-PDIP-T8
JESD-609 Code e0 e3
Length 4.9 mm 9.779 mm
Moisture Sensitivity Level 1
Number of Channels 2 2
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Equivalence Code SOP8,.25 DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Peak Reflow Temperature (Cel) 240
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 4.699 mm
Supply Current-Max (Isup) 0.03 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.4 V 1.4 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn85Pb15) MATTE TIN
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm 7.62 mm
Base Number Matches 3 1
ECCN Code EAR99
HTS Code 8542.39.00.01

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