MIC632BM
vs
MAX632BMJA/883B
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MICREL INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Part Package Code |
SOIC
|
DIP
|
| Package Description |
SOP, SOP8,.25
|
DIP, DIP8,.3
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SWITCHING REGULATOR
|
SWITCHING REGULATOR
|
| Control Mode |
CURRENT-MODE
|
VOLTAGE-MODE
|
| Control Technique |
HYSTERETIC CURRENT MODE
|
|
| Input Voltage-Max |
16.5 V
|
16.5 V
|
| Input Voltage-Min |
2 V
|
2.4 V
|
| JESD-30 Code |
R-PDSO-G8
|
R-GDIP-T8
|
| JESD-609 Code |
e0
|
e0
|
| Length |
4.9 mm
|
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Output Current-Max |
0.45 A
|
0.45 A
|
| Output Voltage-Nom |
12 V
|
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
SOP
|
DIP
|
| Package Equivalence Code |
SOP8,.25
|
DIP8,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
240
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
5.08 mm
|
| Supply Current-Max (Isup) |
0.5 mA
|
|
| Surface Mount |
YES
|
NO
|
| Switcher Configuration |
BOOST
|
BOOST
|
| Switching Frequency-Max |
50 kHz
|
50 kHz
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
3.9 mm
|
7.62 mm
|
| Base Number Matches |
2
|
1
|
| Technology |
|
CMOS
|
|
|
|
Compare MIC632BM with alternatives
Compare MAX632BMJA/883B with alternatives