MIC5841BV
vs
MIC5841YWM
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
17 Weeks, 4 Days
|
| Samacsys Manufacturer |
Microchip
|
Microchip
|
| Built-in Protections |
TRANSIENT
|
TRANSIENT
|
| Interface IC Type |
SIPO BASED PERIPHERAL DRIVER
|
SIPO BASED PERIPHERAL DRIVER
|
| JESD-30 Code |
S-PQCC-J20
|
R-PDSO-G18
|
| JESD-609 Code |
e0
|
e3
|
| Length |
8.94 mm
|
11.55 mm
|
| Moisture Sensitivity Level |
1
|
2
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
18
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Current Flow Direction |
SINK
|
SINK
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
SOP
|
| Package Equivalence Code |
LDCC20,.4SQ
|
SOP18,.40
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.57 mm
|
2.65 mm
|
| Supply Voltage-Max |
12 V
|
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
BICMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
MATTE TIN
|
| Terminal Form |
J BEND
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
8.94 mm
|
7.5 mm
|
| Base Number Matches |
3
|
3
|
| Driver Number of Bits |
|
8
|
| Input Characteristics |
|
STANDARD
|
| Output Polarity |
|
INVERTED
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Supply Current-Max |
|
16 mA
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare MIC5841BV with alternatives
Compare MIC5841YWM with alternatives