MIC5801BWM-TR
vs
MIC5801BVTR
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICREL INC
|
| Package Description |
SOIC-24
|
QCCJ,
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Samacsys Manufacturer |
Microchip
|
|
| Built-in Protections |
TRANSIENT
|
TRANSIENT
|
| Interface IC Type |
LATCH BASED PERIPHERAL DRIVER
|
LATCH BASED PERIPHERAL DRIVER
|
| JESD-30 Code |
R-PDSO-G24
|
S-PQCC-J28
|
| Length |
15.4 mm
|
11.4554 mm
|
| Number of Functions |
8
|
1
|
| Number of Terminals |
24
|
28
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Current Flow Direction |
SINK
|
SINK
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
QCCJ
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
CHIP CARRIER
|
| Seated Height-Max |
2.65 mm
|
4.318 mm
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIMOS
|
BICMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
7.5 mm
|
11.4554 mm
|
| Base Number Matches |
1
|
2
|
| Pbfree Code |
|
No
|
| Rohs Code |
|
No
|
| Part Package Code |
|
QLCC
|
| Pin Count |
|
28
|
| JESD-609 Code |
|
e0
|
| Moisture Sensitivity Level |
|
1
|
| Peak Reflow Temperature (Cel) |
|
240
|
| Terminal Finish |
|
TIN LEAD
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare MIC5801BWM-TR with alternatives
Compare MIC5801BVTR with alternatives