MIC5801BVTR
vs
MIC5801YWM
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Contact Manufacturer
|
| Ihs Manufacturer |
MICREL INC
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
QLCC
|
SOIC
|
| Package Description |
QCCJ,
|
LEAD FREE, SOIC-24
|
| Pin Count |
28
|
24
|
| Reach Compliance Code |
compliant
|
unknown
|
| Built-in Protections |
TRANSIENT
|
TRANSIENT
|
| Interface IC Type |
LATCH BASED PERIPHERAL DRIVER
|
LATCH BASED PERIPHERAL DRIVER
|
| JESD-30 Code |
S-PQCC-J28
|
R-PDSO-G24
|
| JESD-609 Code |
e0
|
e3
|
| Length |
11.4554 mm
|
15.4 mm
|
| Moisture Sensitivity Level |
1
|
2
|
| Number of Functions |
1
|
8
|
| Number of Terminals |
28
|
24
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Current Flow Direction |
SINK
|
SINK
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
SOP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
240
|
|
| Seated Height-Max |
4.318 mm
|
2.65 mm
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
BIMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
MATTE TIN
|
| Terminal Form |
J BEND
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
11.4554 mm
|
7.5 mm
|
| Base Number Matches |
2
|
3
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare MIC5801BVTR with alternatives
Compare MIC5801YWM with alternatives