MIC5504-3.1YMTTZ
vs
MIC5504-3.0YMTTZ
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
SON, SOLCC4,.04,25
|
SON, SOLCC4,.04,25
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Adjustability |
FIXED
|
FIXED
|
| Dropout Voltage1-Nom |
0.16 V
|
0.16 V
|
| Input Voltage Absolute-Max |
6 V
|
6 V
|
| JESD-30 Code |
R-PDSO-N4
|
R-PDSO-N4
|
| JESD-609 Code |
e4
|
e4
|
| Load Regulation-Max |
0.04%
|
0.04%
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
4
|
4
|
| Output Current1-Max |
0.3 A
|
0.3 A
|
| Output Voltage1-Nom |
3.1 V
|
3 V
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SON
|
SON
|
| Package Equivalence Code |
SOLCC4,.04,25
|
SOLCC4,.04,25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.635 mm
|
0.635 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Voltage Tolerance-Max |
3%
|
3%
|
| Base Number Matches |
1
|
1
|
| Line Regulation-Max |
|
0.0135%
|
| Operating Temperature TJ-Max |
|
125 °C
|
| Operating Temperature TJ-Min |
|
-40 °C
|
| Packing Method |
|
TR
|
|
|
|
Compare MIC5504-3.1YMTTZ with alternatives
Compare MIC5504-3.0YMTTZ with alternatives