MIC5319-2.5YD5
vs
MIC5319-3.3BMLTR
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICREL INC
|
| Package Description |
LEAD FREE, MO-193, TSOT-23, 5 PIN
|
VSON, SOLCC6,.08,25
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Dropout Voltage1-Max |
0.4 V
|
0.4 V
|
| Input Voltage-Max |
5.5 V
|
5.5 V
|
| Input Voltage-Min |
2.5 V
|
2.5 V
|
| JESD-30 Code |
R-PDSO-G5
|
S-PDSO-N6
|
| JESD-609 Code |
e4
|
e0
|
| Length |
2.9 mm
|
2 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
5
|
6
|
| Operating Temperature TJ-Max |
125 °C
|
125 °C
|
| Operating Temperature TJ-Min |
-40 °C
|
-40 °C
|
| Output Current1-Max |
0.5 A
|
0.5 A
|
| Output Voltage1-Max |
2.55 V
|
3.366 V
|
| Output Voltage1-Min |
2.445 V
|
3.234 V
|
| Output Voltage1-Nom |
2.5 V
|
3.3 V
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VSSOP
|
VSON
|
| Package Equivalence Code |
TSOP5,.11,37
|
SOLCC6,.08,25
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, VERY THIN PROFILE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Regulator Type |
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
|
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
|
| Seated Height-Max |
1 mm
|
0.9 mm
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.95 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Voltage Tolerance-Max |
2.2%
|
2%
|
| Width |
1.6 mm
|
2 mm
|
| Base Number Matches |
3
|
2
|
| Part Package Code |
|
DFN
|
| Pin Count |
|
6
|
| Manufacturer Package Code |
|
MLF
|
| Adjustability |
|
FIXED
|
| Dropout Voltage1-Nom |
|
0.2 V
|
| Input Voltage Absolute-Max |
|
6 V
|
| Line Regulation-Max |
|
0.01188%
|
| Load Regulation-Max |
|
0.0165%
|
| Number of Outputs |
|
1
|
| Packing Method |
|
TR
|
| Peak Reflow Temperature (Cel) |
|
240
|
| Technology |
|
CMOS
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare MIC5319-2.5YD5 with alternatives
Compare MIC5319-3.3BMLTR with alternatives