MIC5259-2.8YML
vs
MIC5259-3.0BMLTR
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICREL INC
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Dropout Voltage1-Max |
0.55 V
|
0.55 V
|
| Input Voltage-Max |
6 V
|
6 V
|
| Input Voltage-Min |
2.7 V
|
2.7 V
|
| JESD-30 Code |
S-XDSO-N6
|
S-XDSO-N6
|
| JESD-609 Code |
e4
|
e0
|
| Length |
2 mm
|
2 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
6
|
6
|
| Operating Temperature TJ-Max |
125 °C
|
125 °C
|
| Operating Temperature TJ-Min |
-40 °C
|
-40 °C
|
| Output Current1-Max |
0.3 A
|
0.3 A
|
| Output Voltage1-Max |
2.842 V
|
3.005 V
|
| Output Voltage1-Min |
2.758 V
|
2.995 V
|
| Output Voltage1-Nom |
2.8 V
|
3 V
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVSON
|
HVSON
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Regulator Type |
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
|
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
|
| Seated Height-Max |
0.85 mm
|
0.85 mm
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN LEAD
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Voltage Tolerance-Max |
1.5%
|
3%
|
| Width |
2 mm
|
2 mm
|
| Base Number Matches |
3
|
2
|
| Part Package Code |
|
DFN
|
| Package Description |
|
HVSON, SOLCC6,.08,25
|
| Pin Count |
|
6
|
| Manufacturer Package Code |
|
MLF
|
| Adjustability |
|
FIXED
|
| Dropout Voltage1-Nom |
|
0.3 V
|
| Input Voltage Absolute-Max |
|
7 V
|
| Line Regulation-Max |
|
0.018%
|
| Load Regulation-Max |
|
0.09%
|
| Number of Outputs |
|
1
|
| Package Equivalence Code |
|
SOLCC6,.08,25
|
| Packing Method |
|
TR
|
| Peak Reflow Temperature (Cel) |
|
240
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare MIC5259-2.8YML with alternatives
Compare MIC5259-3.0BMLTR with alternatives