MIC5209YML-TR
vs
MIC5209YML
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
7 Weeks
|
|
| Samacsys Manufacturer |
Microchip
|
|
| Adjustability |
ADJUSTABLE
|
|
| Dropout Voltage1-Max |
0.6 V
|
0.6 V
|
| Dropout Voltage1-Nom |
0.35 V
|
|
| JESD-30 Code |
S-PDSO-N8
|
S-XDSO-N8
|
| JESD-609 Code |
e4
|
e4
|
| Length |
3 mm
|
3 mm
|
| Line Regulation-Max (%/V) |
0.0075
|
|
| Load Regulation-Max(%) |
0.7%
|
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Outputs |
1
|
|
| Number of Terminals |
8
|
8
|
| Operating Temperature TJ-Max |
125 °C
|
125 °C
|
| Operating Temperature TJ-Min |
-40 °C
|
-40 °C
|
| Output Current1-Max |
0.5 A
|
0.5 A
|
| Output Voltage1-Max |
15 V
|
|
| Output Voltage1-Min |
1.8 V
|
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
HVSON
|
HVSON
|
| Package Equivalence Code |
SOLCC8,.12,20
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Packing Method |
TR
|
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Regulator Type |
ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR
|
ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR
|
| Seated Height-Max |
0.9 mm
|
1 mm
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| Width |
3 mm
|
3 mm
|
| Base Number Matches |
2
|
4
|
| Package Description |
|
3 X 3 MM, LEAD FREE, MLF-8
|
|
|
|
Compare MIC5209YML-TR with alternatives
Compare MIC5209YML with alternatives