MIC5191BMM
vs
MIC5191BML
feature comparison
Pbfree Code |
No
|
No
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MICREL INC
|
MICREL INC
|
Part Package Code |
MSOP
|
DFN
|
Package Description |
TSSOP, SOLCC10,.11,20
|
3 X 3 MM, MLF-10
|
Pin Count |
10
|
10
|
Reach Compliance Code |
not_compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog IC - Other Type |
ANALOG CIRCUIT
|
ANALOG CIRCUIT
|
JESD-30 Code |
S-PDSO-G10
|
S-XDSO-N10
|
JESD-609 Code |
e0
|
e0
|
Length |
3 mm
|
3 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
10
|
10
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Current-Max |
1 A
|
1 A
|
Output Voltage-Max |
5.5 V
|
5.5 V
|
Output Voltage-Min |
1 V
|
1 V
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Code |
TSSOP
|
VSON
|
Package Equivalence Code |
SOLCC10,.11,20
|
TSSOP10,.19,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
240
|
240
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.1 mm
|
1 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
1 V
|
1 V
|
Supply Voltage-Nom (Vsup) |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
Tin/Lead (Sn85Pb15)
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
GULL WING
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
3 mm
|
3 mm
|
Base Number Matches |
2
|
2
|
Manufacturer Package Code |
|
MLF
|
|
|
|
Compare MIC5191BMM with alternatives
Compare MIC5191BML with alternatives