MIC38HC42BN
vs
MIC38C42YMM
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
DIP
|
|
| Pin Count |
8
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SWITCHING CONTROLLER
|
SWITCHING CONTROLLER
|
| Control Mode |
CURRENT-MODE
|
CURRENT-MODE
|
| Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
| Input Voltage-Max |
30 V
|
18 V
|
| Input Voltage-Min |
10 V
|
12 V
|
| Input Voltage-Nom |
15 V
|
15 V
|
| JESD-30 Code |
R-PDIP-T8
|
S-PDSO-G8
|
| JESD-609 Code |
e0
|
e4
|
| Length |
9.525 mm
|
3 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Current-Max |
1 A
|
0.5 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
TSSOP
|
| Package Equivalence Code |
DIP8,.3
|
TSSOP8,.19
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
IN-LINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
NO
|
YES
|
| Switcher Configuration |
BOOST
|
BUCK
|
| Switching Frequency-Max |
500 kHz
|
500 kHz
|
| Technology |
BICMOS
|
BICMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
3 mm
|
| Base Number Matches |
1
|
3
|
| Rohs Code |
|
Yes
|
| Package Description |
|
TSSOP,
|
| Factory Lead Time |
|
33 Weeks
|
| Moisture Sensitivity Level |
|
1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Seated Height-Max |
|
1.1 mm
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare MIC38HC42BN with alternatives
Compare MIC38C42YMM with alternatives