MIC3809YMM
vs
MIC3809BMMTR
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICREL INC
|
Reach Compliance Code |
compliant
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
11 Weeks
|
|
Samacsys Manufacturer |
Microchip
|
|
Analog IC - Other Type |
SWITCHING CONTROLLER
|
SWITCHING CONTROLLER
|
Control Mode |
CURRENT-MODE
|
CURRENT-MODE
|
Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
Input Voltage-Max |
13 V
|
13 V
|
Input Voltage-Min |
4.2 V
|
4.2 V
|
Input Voltage-Nom |
10 V
|
10 V
|
JESD-30 Code |
S-PDSO-G8
|
S-PDSO-G8
|
JESD-609 Code |
e4
|
e0
|
Length |
3 mm
|
3 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Current-Max |
1 A
|
1 A
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
TSSOP
|
Package Equivalence Code |
TSSOP8,.19
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
240
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.1 mm
|
1.1 mm
|
Surface Mount |
YES
|
YES
|
Switcher Configuration |
PUSH-PULL
|
PUSH-PULL
|
Switching Frequency-Max |
1000 kHz
|
1000 kHz
|
Technology |
BICMOS
|
BICMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN LEAD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
40
|
30
|
Width |
3 mm
|
3 mm
|
Base Number Matches |
3
|
1
|
Part Package Code |
|
MSOP
|
Package Description |
|
TSSOP,
|
Pin Count |
|
8
|
|
|
|
Compare MIC3809YMM with alternatives
Compare MIC3809BMMTR with alternatives