MIC2211-FOBML
vs
SIP2213DMP-FO-T1
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MICREL INC
|
VISHAY SILICONIX
|
| Part Package Code |
DFN
|
SOIC
|
| Package Description |
3 X 3 MM, MLF-10
|
HVSSOF, SOLCC10,.11,20
|
| Pin Count |
10
|
10
|
| Manufacturer Package Code |
MLF
|
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Adjustability |
FIXED
|
FIXED
|
| Dropout Voltage1-Max |
0.25 V
|
0.25 V
|
| Dropout Voltage1-Nom |
0.24 V
|
0.24 V
|
| Dropout Voltage2-Max |
0.42 V
|
0.42 V
|
| Input Voltage Absolute-Max |
7 V
|
7 V
|
| Input Voltage-Max |
5.5 V
|
5.5 V
|
| Input Voltage-Min |
2.25 V
|
2.25 V
|
| JESD-30 Code |
S-XDSO-N10
|
S-PDSO-F10
|
| JESD-609 Code |
e0
|
e0
|
| Length |
3 mm
|
3 mm
|
| Line Regulation-Max |
0.027%
|
0.0174%
|
| Load Regulation-Max |
0.0435%
|
0.0435%
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Outputs |
2
|
2
|
| Number of Terminals |
10
|
10
|
| Operating Temperature TJ-Max |
125 °C
|
125 °C
|
| Operating Temperature TJ-Min |
-40 °C
|
-40 °C
|
| Output Current1-Max |
0.15 A
|
0.15 A
|
| Output Current2-Max |
0.3 A
|
0.3 A
|
| Output Voltage1-Max |
1.53 V
|
1.53 V
|
| Output Voltage1-Min |
1.47 V
|
1.47 V
|
| Output Voltage1-Nom |
1.5 V
|
1.5 V
|
| Output Voltage2-Max |
2.958 V
|
2.958 V
|
| Output Voltage2-Min |
2.842 V
|
2.842 V
|
| Output Voltage2-Nom |
2.9 V
|
2.9 V
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVSON
|
HVSSOF
|
| Package Equivalence Code |
SOLCC10,.11,20
|
SOLCC10,.11,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
240
|
NOT SPECIFIED
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Regulator Type |
FIXED POSITIVE MULTIPLE OUTPUT LDO REGULATOR
|
FIXED POSITIVE MULTIPLE OUTPUT LDO REGULATOR
|
| Seated Height-Max |
1 mm
|
1 mm
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
Tin/Lead (Sn85Pb15)
|
|
| Terminal Form |
NO LEAD
|
FLAT
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Voltage Tolerance-Max |
2%
|
2%
|
| Width |
3 mm
|
3 mm
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
No
|
| Packing Method |
|
TR
|
|
|
|
Compare MIC2211-FOBML with alternatives
Compare SIP2213DMP-FO-T1 with alternatives